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Key Features
✓
Metal substrate core (Aluminum or Copper)
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Exceptional heat dissipation
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High mechanical strength
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Excellent dimensional stability
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Low thermal expansion
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Superior reliability at high temperatures
Technical Specifications
| Layer Count | 1-2 Conductive Layers |
| Metal Substrate | Aluminum 1.0mm - 3.0mm |
| Dielectric Thickness | 0.1mm - 0.3mm |
| Min Line Width | 0.1mm |
| Thermal Conductivity | 1-3 W/mK |
| Operating Temperature | -40°C to +150°C |
| Surface Finish | HASL, ENIG, IMMERSION |
| Max Size | 500mm x 600mm |
Applications
LED lighting systems
Power converters
Motor drivers
High-power amplifiers
Audio amplifiers
Automotive lighting
Industrial heating
Microwave components
Manufacturing Process
1
Substrate Preparation
Metal substrate (Aluminum/Copper) cleaned and inspected
2
Dielectric Application
Thermal insulating layer applied with precise thickness control
3
Copper Lamination
Copper foil bonded to dielectric layer under pressure and heat
4
Circuit Pattern
Circuit etched and finished with protective coating
Certifications & Standards
✓RoHS Compliant
✓ISO 9001:2015
✓AEC-Q200 (Automotive)
✓UL Certified
Competitive Advantages
▸Superior thermal dissipation (20x better than FR-4)
▸Reduced need for heatsinks
▸Extended component lifespan
▸Improved reliability in high-temperature environments
▸Cost-effective heat management solution
▸Excellent for LED applications
