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Key Features
✓
Copper traces on both sides
✓
Via interconnections
✓
Higher circuit density
✓
Better signal integrity
✓
Through-hole mounting
✓
Enhanced thermal management
Technical Specifications
| Layer Count | 2 |
| Min Line Width | 0.075mm |
| Min Trace Spacing | 0.075mm |
| Min Via Size | 0.25mm |
| Copper Thickness | 0.5oz - 3oz |
| Board Thickness | 0.8mm - 3.2mm |
| Surface Finish | HASL, ENIG, OSP, IMMERSION |
| Max Size | 600mm x 800mm |
Applications
Industrial control systems
Power management circuits
Communication modules
Consumer devices
Automotive electronics
Medical devices
RF & microwave circuits
Manufacturing Process
1
Layer Stack-Up Design
Optimized layout for signal integrity and power distribution
2
Inner Layer Imaging
Precision photolithography for both copper layers
3
Layer Lamination
Vacuum pressing bonds layers with dielectric material
4
Via Drilling & Plating
Through-hole vias created and electroplated for inter-layer connectivity
Certifications & Standards
✓RoHS Compliant
✓ISO 9001:2015
✓IPC-6012
✓UL Certified
✓IPC-A-600
Competitive Advantages
▸Support for complex circuit designs
▸Improved noise immunity
▸Better power distribution
▸Higher component density
▸Professional-grade reliability
▸Suitable for volume production
